Numerical Investigation on Heat Pipe Spanwise Spacing to Determine Optimum Configuration for Passive Cooling of Photovoltaic Panels

نویسندگان
چکیده

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Investigation of Packaged Miniature Heat Pipe for Notebook PC Cooling

Miniature heat pipe (MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP on the very limited space of a notebook PC. A cross-sectional area of the pipe is reduced about 30% when the MHP with 4mm diameter is pressed to 2mm thickness. In this study, a performance test has been performed in order to r...

متن کامل

Passive Energy Air-to-Water Heat Pipe Based Heat Exchanger and its Potential of Air Pre-cooling in Air Conditioning Systems for Iran Climate

Air pre-cooling equipment is normally being employed in air-conditioning systems for pre-cooling the ambient outdoor air to enhance the air-conditioning systems performance. In this study, the potential of a passive water-to-air heat pipe based heat exchanger (HPHEX) for air pre-cooling purpose in air-conditioning systems for the high cooling load demanding regions of Iran was investigated. To ...

متن کامل

Experimental Investigation of Heat Transfer Enhancement in a Finned U-Shaped Heat Pipe of CPU Cooling System Using Different Fluids

This paper experimentally studies the heat absorption performance of a heat sink with vertical embedded heat pipes in the aluminum blade. The cooling system with embedded heat pipes distributes heat from the CPU to both the base plate and the heat pipes, and then transfer heat from fins to the Environment. The thermal resistance and heat transfer coefficient are evaluated for natural convection...

متن کامل

Experimental Investigation on Thermal Performance of Cooling System Using Thermoelectric Module Integrated with Heat Pipe

ARTICLE INFO Cooling of electronics component is one of the major challenges faced by thermal engineers. In recent years, a significant increase in microprocessor power dissipation coupled with CPU size has resulted in an increase in heat fluxes. Microprocessor heat fluxes have also increased for many commercial applications. Therefore, thermal management is becoming one of most challenging iss...

متن کامل

Optimum fin spacing for fan-cooled heat sinks

3135 S. State St. Suite 108 Ann Arbor MI 48108 Phone: 734-761-1956 Fax: 734-761-9855 Email: [email protected] Optimum fin spacing for fan-cooled heat sinks

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Energies

سال: 2019

ISSN: 1996-1073

DOI: 10.3390/en12244635